The epoxy adhesive Resinpal 2791 is a crystal clear 2-component adhesive based on epoxy resin.
The thixotropic adhesive Resinpal 2791 can be used for bonding metal, wood, rigid foams, GRP components, concrete, stone and much more.
The clear expression of the epoxy adhesive ensures that the processor can also check or adjust the area to be bonded through the resin.
The epoxy adhesive Resinpal 2791 can be filled with fillers such as cotton flakes, glass fiber chips and hollow glass spheres. This can change the viscosity or the mechanical properties of the epoxy adhesive.
Resinpal 2791 is mixed in a ratio of 100 parts resin to 50 parts hardener (by weight). Resinpal 2791 can be colored with epoxy color pastes. The minimum processing temperature is 18 ° C. The processing time is approx. 20 to 25 minutes.